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Standard injection molding exerts pressures ranging typically from
5,000 to 20,000 psi in the
cavity. Many components were never designed to be overmolded. The injection pressure
forces material out every opening that is not sealed, or crushes thin walls,
destroying the component.
Typical cavity pressures for low injection molding are between 30 and 300 psi
in the cavity. This opens a whole range of components that can be molded,
creating new opportunities to design encapsulated interconnects. This process
can also reduce the expense of building and assembling clam shell components
to cover a connector.
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